Mil-G-45204 (Type II, Grade C & Type III, Grade A)
ASTM-B-488-01(Type II, Code C & Type III, Code A)

CTI is Nadcap certified for both Type 2 and Type 3 gold plating.

Gold plating is used extensively throughout the electronics, semiconductor and space industries. The nature of this noble metal readily lends itself to high reliability applications for land, sea and space based communications components. Type II deposits contain hardening agents (i.e. nickel, cobalt) and are used quite commonly for electronic connectors. While Type III deposits are pure gold (99.9%) and are used in wire bonding and die bonding applications for hi-rel circuitry. Both types are extremely solderable and conductive and can be plated (usually with a nickel under-plate) on most common metals.