Bright Tin-Lead plating provides solderability for a variety of substrates. The tin-lead top coat prevents oxidation of copper and nickel substrates (or under-plates) caused by storage and humidity. It also prevents oxidation of these substrates caused by heat during the soldering operation while also providing a pre-tinned surface. Bright Tin-Lead can be applied to all common metals including ferrous materials and stainless steels. In most cases it is recommended that the tin-lead layer be preceded by a barrier layer of copper and/or nickel.